LT3959EUHE 查看數據表（PDF） - Linear Technology

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LT3959EUHE

Wide Input Voltage Range Boost/SEPIC/Inverting Converter with 6A, 40V Switch

Linear Technology 

Package Description

Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.

UHE Package

Variation: UHE36(28)MA

36(28)-Lead Plastic QFN (5mm × 6mm)

(Reference LTC DWG # 05-08-1836 Rev D)

28 27

25 24 23

21 20

0.70 ±0.05

30

31

5.50 ± 0.05

4.10 ± 0.05

32

33

34

1.50 REF

35

36

1.88

± 0.05

3.00 ± 0.05

0.12

± 0.05

1.53

± 0.05

3.00 ± 0.05

0.48 ± 0.05

17

16

15

14

PACKAGE OUTLINE

13

12

LT3959

12 34

0.50 BSC

6

8 9 10

0.25 ±0.05

2.00 REF

5.10 ± 0.05

6.50 ± 0.05

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

5.00 ± 0.10

PIN 1

TOP MARK

(NOTE 6)

6.00 ± 0.10

0.75 ± 0.05

0.200 REF

0.00 – 0.05

R = 0.10

TYP

28

27

2.00 REF

25

24

23

21

20

1.50 REF

30 31 32 33 34 35 36

1.88 ± 0.10

3.00 ± 0.10

0.12

± 0.10

PIN 1 NOTCH

R = 0.30 OR

0.35 × 45°

CHAMFER

1

2

3

4

1.53 ± 0.10

0.48 ± 0.10

3.00 ± 0.10

17 16 15

0.25 ± 0.05

0.50 BSC

14 13 12

BOTTOM VIEW—EXPOSED PAD

6

8 R = 0.125

TYP

9

10

0.40 ± 0.10

(UHE36(28)MA) QFN 0112 REV D

NOTE:

1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

3959fa

For more information www.linear.com/LT3959

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