LTC1669IMS8-PBF 查看數據表（PDF） - Linear Technology

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LTC1669IMS8-PBF

10-Bit Rail-to-Rail Micropower DAC with I2C Interface

Linear Technology 

LTC1669

PACKAGE DESCRIPTION

MS8 Package

8-Lead Plastic MSOP

(Reference LTC DWG # 05-08-1660)

0.889 ± 0.127

(.035 ± .005)

3.00 ± 0.102

(.118 ± .004)

(NOTE 3)

8 7 65

0.52

(.0205)

REF

5.23

(.206)

MIN

3.20 – 3.45

(.126 – .136)

0.254

(.010)

DETAIL “A”

0° – 6° TYP

4.90 ± 0.152

(.193 ± .006)

0.42 ± 0.038

(.0165 ± .0015)

TYP

0.65

(.0256)

BSC

RECOMMENDED SOLDER PAD LAYOUT

GAUGE PLANE

0.53 ± 0.152

(.021 ± .006)

DETAIL “A”

0.18

(.007)

NOTE:

1. DIMENSIONS IN MILLIMETER/(INCH)

2. DRAWING NOT TO SCALE

3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

SEATING

PLANE

1 234

1.10

(.043)

MAX

0.22 – 0.38

(.009 – .015)

TYP

0.65

(.0256)

BSC

3.00 ± 0.102

(.118 ± .004)

(NOTE 4)

0.86

(.034)

REF

0.127 ± 0.076

(.005 ± .003)

MSOP (MS8) 0603

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

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