MC100EL91(2016) 查看數據表（PDF） - ON Semiconductor
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MC100EL91 Datasheet PDF : 5 Pages
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MC100EL91
VCC Q0 Q0 GND Q1 Q1 GND Q2 Q2 VCC
20 19 18 17 16 15 14 13 12 11
ECL
ECL
ECL
PECL
PECL
PECL
1 2 3 4 5 6 7 8 9 10
VCC D0 D0
D1 D1
D2 D2 VEE
Table 1. PIN DESCRIPTION
PIN
Dn, Dn
Qn, Qn
PECL VBB
VCC
VEE
GND
FUNCTION
PECL Inputs
ECL Outputs
PECL Reference Voltage Output
Positive Supply
Negative Supply
Ground
**All VCC pins are tied together on the die.
Warning: All VCC, VEE, and GND pins must be externally
connected to Power Supply to guarantee proper operation.
Figure 1. 20-Lead Pinout (Top View) and Logic Diagram
Table 2. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC PECL Power Supply
VEE
NECL Power Supply
VI
PECL Input Voltage
Iout
Output Current
GND = 0 V
GND = 0 V
GND = 0 V
Continuous
Surge
VI ≤ VCC
8 to 0
V
−8 to 0
V
6 to 0
V
50
mA
100
IBB
PECL VBB Sink/Source
TA
Operating Temperature Range
Tstg
Storage Temperature Range
qJA
Thermal Resistance (Junction-to-Ambient) 0 lfpm
500 lfpm
SOIC−20 WB
± 0.5
−40 to +85
−65 to +150
90
60
mA
°C
°C
°C/W
qJC
Thermal Resistance (Junction-to-Case)
Tsol
Wave Solder (Pb-Free)
Standard Board
SOIC−20 WB
<2 to 3 sec @ 248°C
30 to 35
265
°C/W
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
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