MC100H642FNG 查看數據表（PDF） - ON Semiconductor
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MC100H642FNG Datasheet PDF : 10 Pages
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MC10H642, MC100H642
Table 5. 10H/100H TTL DC CHARACTERISTICS (VT = VE = 5.0 V ± 5%)
TA = 0°C
TA = 25°C
TA = 85°C
Symbol
Characteristic
Condition
Min Max Min Max Min Max Unit
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
IIH
Input HIGH Current
IIL
Input LOW Current
VOH
Output HIGH Voltage
VIN = 2.7 V
VIN = 7.0 V
VIN = 0.5 V
IOH = −3.0 mA
IOH = −15 mA
2.0
2.0
2.0
V
0.8
0.8
0.8
20
20
20
mA
100
100
100
−0.6
−0.6
−0.6
mA
2.5
2.5
2.5
V
2.0
2.0
2.0
VOL
Output LOW Voltage
VIK
Input Clamp Voltage
IOS
Output Short Circuit Current
IOL = 24 mA
IIN = −18 mA
VOUT = 0 V
0.5
0.5
0.5
V
−1.2
−1.2
−1.2
V
−100 −225 −100 −225 −100 −225 mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
Table 6. AC CHARACTERISTICS (VT = VE = 5.0 V ± 5%)
Symbol
tPLH
tskpp
tskwd*
tPLH
tskpp
Characteristic
Propagation Delay
D to Output
Q2−Q7
C ECL
C TTL
Part−to−Part Skew
Within−Device Skew
Propagation Delay
D to Output
Q0, Q1
C ECL
C TTL
Part−to−Part Skew
All
Outputs
Condition
CL = 25 pF
CL = 25 pF
CL = 25 pF
TA = 0°C
Min Max
TA = 25°C
Min Max
TA = 85°C
Min Max
Unit
ns
4.70 5.70 4.75 5.75 4.60 5.60
4.70 5.70 4.75 5.75 4.50 5.50
1.0
1.0
1.0
ns
0.5
0.5
0.5
ns
ns
4.30 5.30 4.50 5.50 4.25 5.25
4.30 5.30 4.50 5.50 4.25 5.25
2.0
2.0
2.0
ns
tskwd
tPD
Within−Device Skew
Propagation Delay
R to Output
All
Outputs
CL = 25 pF
CL = 25 pF
1.0
1.0
1.0
ns
4.3
6.3
4.0
6.0
4.5
6.5
ns
tR
tF
fMAX**
RPW
RRT
Output Rise/Fall Time
0.8 V to 2.0 V
All
Outputs
Maximum Input Frequency
Reset Pulse Width
Reset Recovery Time
CL = 25 pF
CL = 25 pF
2.5
2.5
2.5
ns
2.5
2.5
2.5
100
100
100
MHz
1.5
1.5
1.5
ns
1.25
1.25
1.25
ns
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
* Within−Device Skew defined as identical transactions on similar paths through a device.
**MAX Frequency is 135 MHz.
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