MC74LVX259 查看數據表（PDF） - ON Semiconductor
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MC74LVX259 Datasheet PDF : 10 Pages
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MC74LVX259
ORDERING INFORMATION
Device
Package
Shipping†
MC74LVX259D
SOIC−16
48 Units / Rail
MC74LVX259DG
SOIC−16
(Pb−Free)
48 Units / Rail
MC74LVX259DR2
SOIC−16
2500 Tape & Reel
MC74LVX259DR2G
SOIC−16
(Pb−Free)
2500 Tape & Reel
MC74LVX259DT
TSSOP−16*
96 Units / Rail
MC74LVX259DTR2
TSSOP−16*
2500 Tape & Reel
MC74LVX259M
SOEIAJ−16
50 Units / Rail
MC74LVX259MG
SOEIAJ−16
(Pb−Free)
50 Units / Rail
MC74LVX259MEL
SOEIAJ−16
2000 Tape & Reel
MC74LVX259MELG
SOEIAJ−16
(Pb−Free)
2000 Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*This package is inherently Pb−Free.
EMBOSSED CARRIER DIMENSIONS (See Notes 6 and 7)
Tape B1
Size Max
D
D1
E
F
K
P
P0
P2
R
T
W
8 mm 4.35 mm
(0.179”)
12 mm 8.2 mm
(0.323”)
1.5 mm
+ 0.1
−0.0
(0.059”
+0.004
−0.0)
1.0 mm
Min
(0.179”)
1.5 mm
Min
(0.060)
1.75 mm
±0.1
(0.069
±0.004”)
3.5 mm
±0.5
(1.38
±0.002”)
5.5 mm
±0.5
(0.217
±0.002”)
2.4 mm
Max
(0.094”)
6.4 mm
Max
(0.252”)
4.0 mm
±0.10
(0.157
±0.004”)
4.0 mm
±0.10
(0.157
±0.004”)
8.0 mm
±0.10
(0.315
±0.004”)
4.0 mm
±0.1
(0.157
±0.004”)
2.0 mm
±0.1
(0.079
±0.004”)
25 mm
(0.98”)
30 mm
(1.18”)
0.6 mm
(0.024)
8.3 mm
(0.327)
12.0 mm
±0.3
(0.470
±0.012”)
16 mm 12.1 mm
(0.476”)
7.5 mm
±0.10
(0.295
±0.004”)
7.9 mm
Max
(0.311”)
4.0 mm
±0.10
(0.157
±0.004”)
8.0 mm
±0.10
(0.315
±0.004”)
12.0 mm
±0.10
(0.472
±0.004”)
16.3 mm
(0.642)
24 mm 20.1 mm
(0.791”)
11.5 mm
±0.10
(0.453
±0.004”)
11.9 mm
Max
(0.468”)
16.0 mm
±0.10
(0.63
±0.004”)
24.3 mm
(0.957)
6. Metric Dimensions Govern−English are in parentheses for reference only.
7. A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be within 0.05 mm min to
0.50 mm max. The component cannot rotate more than 10° within the determined cavity
http://onsemi.com
7
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