MCP9701T(2005) 查看數據表（PDF） - Microchip Technology
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MCP9701T Datasheet PDF : 18 Pages
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4.4 Thermal Considerations
The MCP9700/01 measures temperature by monitor-
ing the voltage of a diode located in the die. A
low-impedance thermal path between the die and the
PCB is provided by the pins. Therefore, the
MCP9700/01 effectively monitors the temperature of
the PCB. However, the thermal path for the ambient air
is not as efficient because the plastic device package
functions as a thermal insulator from the die. This limi-
tation applies to plastic-packaged silicon temperature
sensors. If the application requires measuring ambient
air, the PCB needs to be designed with proper thermal
conduction to the sensor pins.
The MCP9700/01 is designed to source/sink 100 µA
(max.). The power dissipation due to the output current
is relatively insignificant. The effect of the output
current can be described using Equation 5-1.
EQUATION 4-2: EFFECT OF
SELF-HEATING
TJ – TA = θJA(VDDIDD + (VDD – VOUT)IOUT)
Where:
TJ = Junction Temperature
TA = Ambient Temperature
θJA = Package Thermal Resistance
(331°C/W)
VOUT = Sensor Output Voltage
IOUT = Sensor Output Current
IDD = Operating Current
VDD = Operating Voltage
At TA = +25°C (VOUT = 0.75V) and maximum specifica-
tion of IDD = 12 µA, VDD = 5.5V and IOUT = +100 µA,
the self-heating due to power dissipation (TJ – TA) is
0.179°C.
MCP9700/01
© 2005 Microchip Technology Inc.
DS21942B-page 9
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