MPXV7025G(2005) 查看數據表（PDF） - Freescale Semiconductor

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MPXV7025G
(Rev.:2005)

Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated

Freescale Semiconductor 

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

Freescale designates the two sides of the pressure sensor

as the Pressure (P1) side and the Vacuum (P2) side. The

Pressure (P1) side is the side containing fluorosilicone gel

which protects the die from harsh media. The MPX pressure

sensor is designed to operate with positive differential

pressure applied, P1 > P2.

The Pressure (P1) side may be identified by using the

table below:

Part Number

MPX7025GC6U/C6T1

MPXV7025GP

MPXV7025DP

Case Type

482A

1369

1351

Pressure (P1)

Side Identifier

Gauge, Axial Port, SMT

Side with Port Attached

Side with Part Marking

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the surface mount packages must be

the correct size to ensure proper solder connection interface

between the board and the package. With the correct

footprint, the packages will self align when subjected to a

solder reflow process. It is always recommended to design

boards with a solder mask layer to avoid bridging and

shorting between solder pads.

0.660

16.76

0.100 TYP 8X

2.54

0.060 TYP 8X

1.52

0.300

7.62

0.100 TYP 8X

2.54

inch

mm SCALE 2:1

Figure 4. Small Outline Package Footprint

Sensors

Freescale Semiconductor

MPXV7025G

5

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