PMEG2005EPK 查看數據表（PDF） - NXP Semiconductors.
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PMEG2005EPK Datasheet PDF : 13 Pages
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NXP Semiconductors
9. Package outline
PMEG2005EPK
20 V, 0.5 A low VF MEGA Schottky barrier rectifier
0.85
0.75
1
0.80
0.72
0.40
0.32
2
0.75
0.67
Dimensions in mm
Fig 15. Package outline SOD1608
10. Soldering
0.40
0.34
1.65
1.55
0.04
11-11-21
Footprint information for reflow soldering of SOD1608 package
1.15
0.75
1.05
0.65
0.95
0.55
SOD1608
0.9 0.8 0.7
solder land
1
solder land plus solder paste
0.1
0.2
1.8
1.9
2.0
solder paste deposit
occupied area
solder resist
Dimensions in mm
Reflow soldering is the only recommended soldering method.
Fig 16. Reflow soldering footprint for SOD1608
0.7 0.8 0.9
2
sod1608_fr
PMEG2005EPK
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 12 January 2012
© NXP B.V. 2012. All rights reserved.
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