SI3000 查看數據表（PDF） - Silicon Laboratories

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SI3000

VOICEBAND CODEC WITH MICROPHONE/SPEAKER DRIVE

Silicon Laboratories 

Si3000

7. 16-Pin SOIC Land Pattern

Figure illustrates the recommended land pattern for the Si3000 16-pin SOIC. Table 16 lists the values for the

dimensions shown in the illustration.

Figure 20. 16-Pin SOIC Land Pattern Diagram

Table 16. 16-Pin MSOP Land Pattern Dimensions

Dimension

Feature

mm

C1

Pad Column Spacing

5.40

E

Pad Row Pitch

1.27

X1

Pad Width

0.60

Y1

Pad Length

1.55

Notes:

General

1. All dimensions shown are in millimeters (mm) unless otherwise noted.

2. Dimensioning and Tolerancing per ASME Y14.5M-1994.

3. This Land Pattern Design is based on the IPC-7351 guidelines.

4. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated based on a

Fabrication Allowance of 0.05 mm.

Solder Mask Design

5. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm

minimum, all the way around the pad.

Stencil Design

6. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.

7. The stencil thickness should be 0.125 mm (5 mils).

8. The ratio of stencil aperture to land pad size should be 1:1.

Card Assembly

9. A No-Clean, Type-3 solder paste is recommended.

10. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.

Rev. 1.4

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