STTH602CBY-TR(2012) 查看數據表（PDF） - STMicroelectronics
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STTH602CBY-TR Datasheet PDF : 7 Pages
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STTH602C-Y
2
Package information
Package information
● Epoxy meets UL94, V0
● Cooling method: by conduction (C)
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 6. DPAK dimensions
Ref.
A
E
A
A1
B2
C2
A2
L2
B
H
L4
B
G
B2
D
R
C
C2
A1
R
D
C
E
A2
G
0.60 MIN.
H
V2
L2
L4
V2
Figure 10. Footprint (dimensions in mm)
Dimensions
Millimeters
Inches
Min.
Max.
2.20
2.40
0.90
1.10
0.03
0.23
0.64
0.90
5.20
5.40
0.45
0.60
0.48
0.60
6.00
6.20
6.40
6.60
4.40
4.60
9.35 10.10
0.80 typ.
0.60
1.00
0°
8°
Min.
Max.
0.086 0.094
0.035 0.043
0.001 0.009
0.025 0.035
0.204 0.212
0.017 0.023
0.018 0.023
0.236 0.244
0.251 0.259
0.173 0.181
0.368 0.397
0.031 typ.
0.023 0.039
0°
8°
6.7
3
3
1.6
2.3
6.7
2.3
1.6
Doc ID 023250 Rev 1
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