PCA82C250 查看數據表（PDF） - Philips Electronics
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PCA82C250 Datasheet PDF : 20 Pages
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Philips Semiconductors
CAN controller interface
Product specification
PCA82C250
BONDING PAD LOCATIONS
SYMBOL
TXD
GND
VCC
RXD
Vref
CANL
CANH
Rs
PAD
1
2
3
4
5
6
7
8
COORDINATES(1)
x
y
196
1 280
1 767
2 588
2 594
1 689
948
196
135
135
135
135
1 640
1 640
1 640
1 640
Note
1. All coordinates (µm) represent the position of the centre of each pad with respect to the bottom left-hand corner of
the die (x/y = 0).
handbook, full pagewidth
8
7
6
5
1.78
mm
PCA82C250U
1
x
0
0
y
2
3
2.79 mm
Fig.12 Bonding pad locations.
4
MGL945
2000 Jan 13
14
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