NXP Semiconductors
TDA1308
Class-AB stereo headphone driver
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm
SOT505-1
D
c
y
Z
8
5
E
A
X
HE
vM A
pin 1 index
1
e
4
bp
wM
A2 A1
(A3)
A
θ
Lp
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1) E(2)
e
HE
L
Lp
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.45
0.25
0.28
0.15
3.1
2.9
3.1
2.9
0.65
5.1
4.7
0.94
0.7
0.4
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOT505-1
v
w
y
Z(1)
θ
0.1
0.1
0.1
0.70
0.35
6°
0°
EUROPEAN
PROJECTION
ISSUE DATE
99-04-09
03-02-18
Fig 12. Package outline SOT505-1 (TSSOP8)
TDA1308
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 14 March 2011
© NXP B.V. 2011. All rights reserved.
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