UPD168302MA-6A5-E1 查看數據表（PDF） - NEC => Renesas Technology

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UPD168302MA-6A5-E1

MONOLITHIC 2CH H-BRIDGE DRIVER

NEC => Renesas Technology 

µPD168302

9. RECOMMENDED SOLDERING CONDITIONS

The µPD168302 should be soldered and mounted under the following recommended conditions.

For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales

representative.

For technical information, see the following website.

Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)

µPD168302MA-6A5: 24-pin plastic TSSOP (5.72 mm (225))

Soldering Method

Soldering Conditions

Infrared reflow

Package peak temperature: 260°C, Time: 60 seconds MAX. (at 220°C or

higher), Count: Three times or less, Exposure limit: None, Flux: Rosin flux with

low chlorine (0.2 Wt% or below) recommended

Recommended

Condition

symbol

IR60-00-3

Caution Do not use different soldering methods together (except for partial heating).

10

Data Sheet S16402EJ1V0DS

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