WM8940GEFL 查看數據表（PDF） - Wolfson Microelectronics plc

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WM8940GEFL

Mono CODEC with Speaker Driver

Wolfson Microelectronics plc 

WM8940

PACKAGE DIAGRAM

FL: 24 PIN QFN PLASTIC PACKAGE 4 X 4 X 0.9 mm BODY, 0.50 mm LEAD PITCH

D2

19

24

DETAIL 1

18

A

EXPOSED

GROUND 6

PADDLE

1

E2

SEE DETAIL 2

13

6

12

7

e

BOTTOM VIEW

b1

bbbM C A B

4 INDEX AREA

(D/2 X E/2)

2X

aaa C

2X

aaa C

D

TOP VIEW

DM035.C

E

A3

C

SEATING PLANE

SIDE VIEW

ccc C

A

0.08 C 5

A1

DETAIL 2

A3

b

Exposed lead

W

T

H

G

Half etch tie bar

DETAIL 2

DETAIL 1

0.32mm

45

degrees

EXPOSED

GROUND

PADDLE

DETAIL 2

L

L1

Datum

R

Terminal

tip

e/2

e

Symbols

A

A1

A3

b

D

D2

E

E2

e

G

H

L

L1

T

W

aaa

bbb

ccc

REF:

Dimensions (mm)

MIN

0.80

0

NOM

0.90

0.02

0.20 REF

MAX

1.00

0.05

NOTE

0.18

0.25

0.30

1

4.00

2.00

2.15

2.25

2

4.00

2.00

2.15

2.25

2

0.50 BSC

0.213

0.1

0.30

0.40

0.50

0.03

0.15

7

0.1

0.2

Tolerances of Form and Position

0.15

0.10

0.10

JEDEC, MO-220, VARIATION VGGD-2.

NOTES:

1. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.15 mm AND 0.30 mm FROM TERMINAL TIP.

2. FALLS WITHIN JEDEC, MO-220, VARIATION VGGD-2.

3. ALL DIMENSIONS ARE IN MILLIMETRES.

4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JEDEC 95-1 SPP-002.

5. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS.

6. REFER TO APPLICATIONS NOTE WAN_0118 FOR FURTHER INFORMATION REGARDING PCB FOOTPRINTS AND QFN PACKAGE SOLDERING.

7. DEPENDING ON THE METHOD OF LEAD TERMINATION AT THE EDGE OF THE PACKAGE, PULL BACK (L1) MAY BE PRESENT.

8. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.

Pre-Production

w

Pre-Production, Rev 3.0, February 2007

84

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