DLP0NSA150HL2L 查看數據表（PDF） - Murata Manufacturing

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DLP0NSA150HL2L

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Murata Manufacturing 

PL p Chip Common Mode Choke Coil

Soldering and Mounting

1. Standard Land Pattern Dimensions

PLT10H

oReflow Soldering

PLT10H

Copper Foil Pattern

Copper Foil Pattern + Resist

Resist

(in mm)

4.0

8.0

4.0

o PCB Warping

PCB should be designed so that products are not

subjected to the mechanical stress caused by warping

the board.

Products should be located in the sideways direction

(Length: a<b) to the mechanical stress.

a

b

Poor example

Good example

2. Solder Paste Printing and Adhesive Application

When reflow soldering the chip common mode choke

coils, the printing must be conducted in accordance with

the following cream solder printing conditions.

If too much solder is applied, the chip will be prone to

damage by mechanical and thermal stress from the PCB

and may crack.

Standard land dimensions should be used for resist and

copper foil patterns.

When flow soldering the chip common mode choke coils,

apply the adhesive in accordance with the following

conditions.

If too much adhesive is applied, then it may overflow into

the land or termination areas and yield poor solderability.

In contrast, if insufficient adhesive is applied, or if the

adhesive is not sufficiently hardened, then the chip may

become detached during flow soldering process.

Series

PLT10H

Solder Paste Printing

oGuideline of solder paste thickness:

150-200µm: PLT10H

For the solder paste printing pattern, use standard land dimensions.

*Solderability is subject to reflow conditions and thermal conductivity. Please make sure that your

product has been evaluated in view of your specifications with our product being mounted to your

product.

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

C31E.pdf

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.

Mar.28,2011

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