NXP Semiconductors
MAC97A8; MAC97A6
Logic level triac
5. Thermal characteristics
Table 5.
Symbol
Rth(j-lead)
Rth(j-a)
Thermal characteristics
Parameter
thermal resistance from junction to lead
thermal resistance from junction to ambient
Conditions
full cycle
half cycle
mounted on a printed circuit board;
lead length = 4 mm; Figure 1
5.1 Transient thermal impedance
Value Unit
60
K/W
80
K/W
150
K/W
103
Zth(j-a)
(K/W)
102
003aaa029
10
P
1
10-5
10-4
10-3
10-2
10-1
tp
t
1
10
tp (s)
Fig 1. Transient thermal impedance from junction to ambient as a function of pulse duration.
MAC97A8_A6
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 14 September 2011
© NXP B.V. 2011. All rights reserved.
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