NT3882H 查看數據表（PDF） - Unspecified
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NT3882H Datasheet PDF : 9 Pages
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Bonding Diagram
S
S
S
S
S
S
S
S
S
S
S
S
2
3
3
3
3
3
3
3
3
3
3
4
9
4
3
2
1
0
5
6
7
8
9
0
S28 3
2
63 62 61 60 59 57 56 55 54 53 52
S27 4
S26 5
S25 6
S24 7
S23 8
S22 9
S21 10
S20 11
NT3882H
Y
X
(0,0)
51 V2
48 V3
46
VEE
42 M
40 DR2
2 5 1 4 2m
39 DL2
38 DR1
S19 12
37 DL1
S18 13
S17 14
S16 15
S15 16
36 GND
35 CL2
34 CL1
S14 17
32 S1
S13 18
25
19 20 21 22 23 24
27 28 29 30 31
S
S
S
S
S
S
V
1
9
1
1
8
7
D
2
0
1
D
2235 2m
S
S
S
S
S
6
5
4
3
2
* Connecting IC substrate to VDD or keeping floating is
recommended.
* Pad window area120Pm X 100Pm.
NT3882
7
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