LTM4620A
APPLICATIONS INFORMATION
values of ID), and VG0 is the band gap voltage of 1.2V
extrapolated to absolute zero of –273°C Kelvin. Figure 8
shows a plot of the diode temperature characteristic of
the diode connected PNP transistor biased with a 100µA
current source. This plot would extend to the left back to
1.2V at –273°C Kelvin. This curve is stop at –55°C due to
the test system limits.
If we take the IS equation and substitute into the VD equa-
tion, then we get:
VD
=
VG0
–
Kt
q
ln
I0
ID
,
VT
=
kT
q
The expression shows that the junction voltage of the PNP
connected diode decreases linearly if Io were constant
from a value VG0 of 1.2V at absolute zero to a decreasing
value with increased temperature.
If we take this equation and differentiate it with respect to
temperature T, then:
dVD = – (VG0 – VD) / T This dVD
dT
dT
change as a function of temperature is the typical
~–2mV/°C. This equation is simplified for the first order
derivation.
Solving for T, T = –(VG0 – VD)/ dVD provide the
temperature.
1st Example: Figure 4 for 27°C, or 300°C Kelvin the diode
voltage is 0.598V, thus, 300°C = –(1200mV – 598mV)/
–2mV/°C)
2nd Example: Figure 4 for 75°C, or 350°C Kelvin the diode
voltage is 0.50V, thus, 350°C = –(1200mV – 500mV)/
–2mV/°C)
Converting the Kelvin scale to Celsius is simply taking the
Kelvin temp and subtracting –273°C Kelvin from it.
A typical forward voltage is measured and placed in the
electrical characteristics section of the data sheet, and
Figure 8 is the plot of this forward voltage. Measure this
forward voltage at 27°C to establish a reference point.
Then use the above expression while measuring the
0.8
ID = 100µA
0.7
0.6
0.5
0.4
0.3
–50 –25
0 25 50 75 100 125
TEMPERATURE (°C)
4620A F08
Figure 8. Diode Voltage VD vs Temperature
T(°C) for Different Bias Currents
forward voltage over temperature will provide a general
temperature monitor.
The diode connected PNP transistor can be pulled up to
VIN with a resistor to set the current to 100µA for using
this diode connected transistor as a general temperature
monitor by monitoring the diode voltage drop with tem-
perature. See Figure 27 for an example.
Thermal Considerations and Output Current Derating
The thermal resistances reported in the Pin Configuration
section of the data sheet are consistent with those param-
eters defined by JESD 51-9 and are intended for use with
finite element analysis (FEA) software modeling tools that
leverage the outcome of thermal modeling, simulation,
and correlation to hardware evaluation performed on a
µModule package mounted to a hardware test board—
also defined by JESD 51-9 (“Test Boards for Area Array
Surface Mount Package Thermal Measurements”). The
motivation for providing these thermal coefficients in
found in JESD 51-12 (“Guidelines for Reporting and Using
Electronic Package Thermal Information”).
Many designers may opt to use laboratory equipment and
a test vehicle such as the demo board to anticipate the
µModule regulator’s thermal performance in their appli-
cation at various electrical and environmental operating
For more information www.linear.com/LTM4620A
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