Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-
ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-
tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only. Values are at TA = 25°C unless otherwise specified.
Symbol
Parameter
Min.
Unit
TOPR
TSTG
TSOL(1)
VR
PC
Operating Temperature
Storage Temperature
Soldering Temperature
Reverse Voltage
Power Dissipation at (or below) 25°C
Free Air Temperature
-25 to +85
-40 to + 85
°C
260
32
V
150
mW
Note:
1. Soldering time ≤ 5 s.
Recommend IR Reflow Soldering Profile
1 ~ 3°C/s
1 ~ 3°C/s
Pre-heating
180 ~ 200°C
260°C Max.
10 s Max.
60 s Max.
Above 220°C
120 s Max.
© 2005 Fairchild Semiconductor Corporation
QSB34GR / QSB34ZR / QSB34CGR / QSB34CZR Rev. 1.2.0
2
www.fairchildsemi.com