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LT1767-1.8 查看數據表(PDF) - Linear Technology

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LT1767-1.8 Datasheet PDF : 20 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
LT1767/LT1767-1.8/
LT1767-2.5/LT1767-3.3/LT1767-5
Package description
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660 Rev G)
0.889 ±0.127
(.035 ±.005)
5.10
(.201)
MIN
3.20 – 3.45
(.126 – .136)
0.42 ± 0.038
(.0165 ±.0015)
TYP
0.65
(.0256)
BSC
RECOMMENDED SOLDER PAD LAYOUT
3.00 ±0.102
(.118 ±.004)
(NOTE 3)
8 7 65
0.52
(.0205)
REF
0.254
(.010)
DETAIL “A”
0° – 6° TYP
4.90 ±0.152
(.193 ±.006)
3.00 ±0.102
(.118 ±.004)
(NOTE 4)
GAUGE PLANE
0.18
(.007)
0.53 ±0.152
(.021 ±.006)
DETAIL “A”
1 234
1.10
(.043)
MAX
SEATING
PLANE 0.22 – 0.38
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
(.009 – .015)
TYP
0.65
(.0256)
BSC
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.86
(.034)
REF
0.1016 ±0.0508
(.004 ±.002)
MSOP (MS8) 0213 REV G
For more information www.linear.com/LT1767
1767fb
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