W25Q16DV 查看數據表（PDF） - Winbond
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W25Q16DV Datasheet PDF : 80 Pages
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9.4 8-Pad WSON 6x5mm (Package Code ZP)
SYMBOL
A
A1
b
C
D
D2
E
E2
(2)
e
L
y
MILLIMETERS
Min
Nom
Max
0.70
0.75
0.80
0.00
0.02
0.05
0.35
0.40
0.48
---
0.20 REF.
---
5.90
6.00
6.10
3.35
3.40
3.45
4.90
5.00
5.10
4.25
4.30
4.35
1.27 BSC.
0.55
0.60
0.65
0.00
---
0.075
Min
0.028
0.000
0.014
---
0.232
0.132
0.193
0.167
0.022
0.000
INCHES
Nom
0.030
0.001
0.016
0.008 REF.
0.236
0.134
0.197
0.169
0.050 BSC.
0.024
---
Max
0.031
0.002
0.019
---
0.240
0.136
0.201
0.171
0.026
0.003
Notes:
1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. The metal pad area on the bottom center of the package is connected to the device ground (GND pin). Avoid placement of
exposed PCB vias under the pad.
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