UPC24A12HF 查看數據表（PDF） - NEC => Renesas Technology

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UPC24A12HF

THREE TERMINAL LOW DROPOUT VOLTAGE REGULATOR

NEC => Renesas Technology 

µPC24A00 Series

RECOMMENDED SOLDERING CONDITIONS

The µ PC2400 Series should be soldered and mounted under the following recommended conditions.

For the details of the recommended soldering conditions, refer to the document SEMICONDUCTOR DEVICE

MOUNTING TECHNOLOGY MANUAL (C10535E).

For soldering methods and conditions other than those recommended below, contact your NEC sales

representative.

Through-Hole Device

µ PC24A05HF, 24A12HF, 24A15HF: 3-Pin Plastic SIP (MP-45G) (Isolated TO-220)

Process

Conditions

Wave soldering

Solder temperature: 260°C or below, Flow time: 10 seconds or less.

(only to leads)

Caution Apply wave soldering only to the pins and be careful not to bring solder into direct contact with the

package.

CAUTION ON USE

• In the µPC24A00 Series, if the output is short-circuited at VIN ≥ 20 V, the output may not be restored after the short-

circuit is cancelled. In this case, restore the output by lowering and then reapplying VIN.

• If a lower than recommended input voltage is used in the µPC24A00 Series, a large circuit current will flow due to

the saturation of the output stage transistor (refer to the reference characteristic curve of the IBIAS − VIN

characteristics). The capacitance for the input side power supply therefore needs to be only enough to enable the

current to flow in this circuit at startup. Note also that a resistor cannot be inserted at the GND pin to adjust the

output voltage.

REFERENCE DOCUMENTS

QUALITY GRADES ON NEC SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL

SEMICONDUCTORS SELECTION GUIDE

SEMICONDUCTORS SELECTION GUIDE -Product and Packages- (CD-ROM)

C11531E

C10535E

X10679E

X13769X

Data Sheet G14632EJ3V0DS00

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