SMBG10C 查看數據表（PDF） - GUANGDONG HOTTECH INDUSTRIAL CO.,LTD.
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SMBG10C Datasheet PDF : 4 Pages
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Transient Voltage Suppressors
FEATURES
♦ Plastic package has Underwriters Laboratory Flammability
Classification 94V-0
♦ For surface mounted applications in order to optimize
board space
♦ Low profile package
♦ Built-in strain relief
♦ Glass passivated junction
♦ Low incremental surge resistance
♦ 600W peak pulse power capability with a 10/1000µs
waveform, repetition rate (duty cycle): 0.01%
♦ Excellent clamping capability
♦ Fast response time: typically less than 1.0ps from 0 volts
to V(BR) for unidirectional and 5.0ns for bidirectional types
♦ For devices with V(BR)≥10V, ID are typically less
than 1.0µA
♦ High temperature soldering guaranteed:
250°C/10 seconds at terminals
DEVICES FOR BI-DIRECTION APPLICATIONS
For bi-directional use C or CA suffix (e.g. SMAJ10C,
SMAJ10CA).
Electrical characteristics apply in both directions.
SMBJ5.0 -SMBJ170CA
10
0.083(2.11)
0.077(1.96)
0.180(4.57)
0.160(4.06)
0.096(2.44)
0.084(2.13)
0.060(1.52)
0.030(0.76)
0.220(5.59)
0.205(5.21)
0.155(3.94)
0.130(3.30)
0.012(0.305)
0.006(0.152)
0.008(0.203)
0.004(0.102)
DO-214AA (SMB)
MAXIMUM RATINGS (TA = 25 °C unless otherwise noted)
Peak pulse power dissipation with a 10/1000µs waveform (NOTES 1, 2, FIG. 1)
Peak pulse current with a 10/1000µs waveform (NOTE 1)
Peak forward surge current 8.3ms single half sine-wave superimposed
on rated load (JEDEC Method) (NOTES 2, 3) - unidirectional only
Maximum instantaneous forward voltage at 50A (NOTE 3) unidirectional only
Operating junction and storage temperature range
NOTES:
(1) Non-repetitive current pulse, per Fig.3 and derated above TA=25°C per Fig. 2
(2) Mounted on 0.2 x 0.2” (5.0 x 5.0mm) copper pads to each terminal
(3) Measured on 8.3ms single half sine-wave. For uni-directional devices only.
SYMBOLS
PPPM
IPPM
IFSM
VF
TJ, TSTG
VALUE
Minimum 600
SEE TABLE 1
100.0
3.5
-55 to +150
UNITS
Watts
Amps
Amps
Volts
°C
THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER
SYMBOL
Typical thermal resistance, junction to ambient (1)
RθJA
Typical thermal resistance, junction to lead
RθJL
Note:
(1) Mounted on minimum recommended pad layout
VALUE
120
30
UNIT
°C/W
°C/W
GUANGDONG HOTTECH INDUSTRIAL CO., LTD.
Page:P4-P1
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