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STPS1L30U(1999) 查看數據表(PDF) - STMicroelectronics

零件编号
产品描述 (功能)
生产厂家
STPS1L30U
(Rev.:1999)
ST-Microelectronics
STMicroelectronics 
STPS1L30U Datasheet PDF : 5 Pages
1 2 3 4 5
STPS1L30A/U
Fig. 8-1: Thermal resistance junction to ambient
versus copper surface under each lead (Epoxy
printed circuit board FR4, copper thickness:
35µm) (SMB).
Rth(j-a) (°C/W)
120
100
80
60
40
20
S(Cu) (cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Fig. 8-2: Thermal resistance junction to ambient
versus copper surface under each lead (Epoxy
printed circuit board FR4, copper thickness: 35µm)
(SMA).
Rth(j-a) (°C/W)
140
120
100
80
60
40
20
S(Cu) (cm²)
0
0
1
2
3
4
5
PACKAGE MECHANICAL DATA
SMA
E1
D
E
A1
C
A2
L
b
REF.
A1
A2
b
c
E
E1
D
L
DIMENSIONS
Millimeters
Inches
Min. Max. Min. Max.
1.90 2.70 0.075 0.106
0.05 0.20 0.002 0.008
1.25 1.65 0.049 0.065
0.15 0.41 0.006 0.016
4.80 5.60 0.189 0.220
3.95 4.60 0.156 0.181
2.25 2.95 0.089 0.116
0.75 1.60 0.030 0.063
FOOT PRINT DIMENSIONS (in millimeters)
1.65
1.45
2.40 1.45
4/5

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