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STM1061N53WX6 查看數據表(PDF) - STMicroelectronics

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STM1061N53WX6
ST-Microelectronics
STMicroelectronics 
STM1061N53WX6 Datasheet PDF : 21 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
STM1061
PACKAGE MECHANICAL
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These
packages have a Lead-free second level interconnect. The category of second Level Interconnect is
marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK
is an ST trademark. ECOPACK specifications are available at: www.st.com.
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