BTB12-800C 查看數據表（PDF） - STMicroelectronics
零件编号
产品描述 (功能)
生产厂家
BTB12-800C Datasheet PDF : 16 Pages
| |||
BTA12, BTB12, T1205, T1210, T1235, T1250
Characteristics (curves)
Figure 9. Relative variation of critical rate of decrease of Figure 10. Relative variation of critical rate of decrease of
main current versus (dV/dt)c (typical values)
main current versus (dV/dt)c (typical values)(TW)
(dI/dt )c [(d V/dt )c] / specified (dI/dt )c
2.8
2.4
2.0
C
1.6 B
1.2
T1210/SW
T1235/T1250/CW/BW
0.8
0.4
0.0
0.1
(dV/dt)c(V/µs)
1 .0
10.0
100.0
(dI/dt )c [(d V/dt )c] / specified (dI/dt )c
5.0
4.5
4.0
TW, T1205
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0.1
(dV/dt)c(V/µs)
1.0
10.0
100.0
Figure 11. Relative variation of critical rate of decrease of Figure 12. D2PAK thermal resistance junction to ambient
main current versus junction temperature
versus copper surface under tab
(dl/dt)c [Tj] / (dl/dt)c [Tj specified]
6
5
4
3
2
1
Tj(°C)
0
0
25
50
75
1 00
125
80 Rth(j-a) (°C/W)
70
60
D²PAK
Epoxy printed board FR4, copper thickness = 35 µm
50
40
30
20
10
0
0
SCu(cm²)
5
10
15
20
25
30
35
40
DS2115 - Rev 12
page 6/16
Share Link: 