NXP Semiconductors
Contents
1
Product profile .................................................... 1
1.1
General description ............................................1
1.2
Features and benefits ........................................1
1.3
Applications ........................................................1
2
Pinning information ............................................ 1
3
Ordering information .......................................... 1
4
Marking .................................................................1
5
Limiting values .................................................... 2
6
Thermal characteristics ......................................2
7
Characteristics .................................................... 3
8
Graphical data ..................................................... 4
9
Package outline ...................................................5
10
Revision history .................................................. 6
11
Legal information ................................................ 7
BAP51-03
Silicon PIN diode
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section 'Legal information'.
© NXP B.V. 2019.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 8 February 2019
Document identifier: BAP51-03