ADA4857-2YCPZ-R7 查看數據表（PDF） - Analog Devices

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ADA4857-2YCPZ-R7

Ultralow Distortion, Low Power, Low Noise, High Speed Op Amp

Analog Devices 

ADA4857-1/ADA4857-2

OUTLINE DIMENSIONS

PIN 1 INDEX

AREA

0.80

0.75

0.70

SEATING

PLANE

3.10

3.00 SQ

2.90

1.84

1.74

1.64

5

0.50 BSC

8

TOP VIEW

0.30

0.25

0.20

0.50

0.40

0.30

EXPOSED

PAD

1.55

1.45

1.35

4

1

BOTTOM VIEW

PIN 1

INDICATOR

(R 0.15)

0.05 MAX

0.02 NOM

COPLANARITY

0.08

0.203 REF

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

COMPLIANT TO JEDEC STANDARDS MO-229-WEED

Figure 58. 8-Lead Lead Frame Chip Scale Package [LFCSP]

3 mm × 3 mm Body and 0.75 mm Package Height (CP-8-13)

Dimensions shown in millimeters

5.00 (0.1968)

4.80 (0.1890)

8

4.00 (0.1574)

3.80 (0.1497) 1

5

6.20 (0.2441)

4 5.80 (0.2284)

0.25 (0.0098)

0.10 (0.0040)

1.27 (0.0500)

BSC

1.75 (0.0688)

1.35 (0.0532)

COPLANARITY

0.10 SEATING

PLANE

0.51 (0.0201)

0.31 (0.0122)

0.50 (0.0196)

0.25 (0.0099)

45°

8°

0°

1.27 (0.0500)

0.25 (0.0098) 0.40 (0.0157)

0.17 (0.0067)

COMPLIANT TO JEDEC STANDARDS MS-012-AA

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

Figure 59. 8-Lead Standard Small Outline Package [SOIC_N]

(R-8)

Dimensions shown in millimeters and (inches)

Data Sheet

Rev. D | Page 20 of 21

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