NL27WZ126MU3TCG 查看數據表（PDF） - ON Semiconductor
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NL27WZ126MU3TCG Datasheet PDF : 12 Pages
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NL27WZ126
PACKAGE DIMENSIONS
−X−
A
8
5
−Y−
B
L
1
4
P
G
−T−
SEATING
PLANE
C
K
D
0.10 (0.004) M T X Y
US8
US SUFFIX
CASE 493−02
ISSUE B
J
DETAIL E
R
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION “A” DOES NOT INCLUDE MOLD
FLASH, PROTRUSION OR GATE BURR.
MOLD FLASH. PROTRUSION AND GATE
BURR SHALL NOT EXCEED 0.140 MM
(0.0055”) PER SIDE.
4. DIMENSION “B” DOES NOT INCLUDE
INTER−LEAD FLASH OR PROTRUSION.
INTER−LEAD FLASH AND PROTRUSION
SHALL NOT E3XCEED 0.140 (0.0055”) PER
SIDE.
5. LEAD FINISH IS SOLDER PLATING WITH
THICKNESS OF 0.0076−0.0203 MM.
(300−800 “).
6. ALL TOLERANCE UNLESS OTHERWISE
SPECIFIED ±0.0508 (0.0002 “).
U
0.10 (0.004) T
V
H
N
R 0.10 TYP
M
F
DETAIL E
SOLDERING FOOTPRINT*
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 1.90 2.10 0.075 0.083
B 2.20 2.40 0.087 0.094
C 0.60 0.90 0.024 0.035
D 0.17 0.25 0.007 0.010
F 0.20 0.35 0.008 0.014
G
0.50 BSC
0.020 BSC
H
0.40 REF
0.016 REF
J 0.10 0.18 0.004 0.007
K 0.00 0.10 0.000 0.004
L 3.00 3.20 0.118 0.126
M
0_ 6_ 0_ 6_
N
5 _ 10 _ 5 _ 10 _
P 0.23 0.34 0.010 0.013
R 0.23 0.33 0.009 0.013
S 0.37 0.47 0.015 0.019
U 0.60 0.80 0.024 0.031
V
0.12 BSC
0.005 BSC
3.8
0.015
0.50
1.8
0.0197
0.07
0.30
0.012
1.0
0.0394
ǒ Ǔ SCALE 8:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
8
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