R1513S341B 查看數據表（PDF） - RICOH Co.,Ltd.
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R1513S341B Datasheet PDF : 23 Pages
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R1513S
NO.JA-321-160715
PACKAGE INFORMATION
POWER DISSIPATION (HSOP-6J)
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The
following conditions are used in this measurement.
Measurement Conditions
Environment
Board Material
Board Dimensions
Ultra-high Wattage Land Pattern
Mounting on Board
(Wind Velocity = 0 m/s)
Glass Cloth Epoxy Plastic
(Four-layer Board)
76.2 mm × 114.3 mm × 0.8 mm
Copper Ratio
96%
Through-holes
φ 0.3 mm × 28 pcs
Standard Land Pattern
Mounting on Board
(Wind Velocity = 0 m/s)
Glass Cloth Epoxy Plastic
(Double-sided Board)
50 mm × 50 mm × 1.6 mm
50%
φ 0.5 mm × 24 pcs
Measurement Result
Power Dissipation
Thermal Resistance
(Ta = 25°C, Tjmax = 150°C)
Ultra-high Wattage Land Pattern Standard Land Pattern
Free Air
3400 mW
2100 mW
675 mW
37°C/W
59°C/W
185°C/W
3500
3250 3400
3000
2750
2500
2250
2000 2100
1750
1500
1250
1000
750
500 675
250
0
0
25
On Board
Ultra-high Wattage
Land Pattern
On Board
Standard Land Pattern
Free Air
50
75
100 125 150
Ambient Temperature (°C)
Power Dissipation vs. Ambient Temperature
76.2
50
50
20
Ultra-high Wattage
Standard
IC Mount Area (mm)
Measurement Board Pattern
10
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