MCP1811A/11B/12A/12B
TEMPERATURE SPECIFICATIONS
Parameters
Sym. Min. Typ.
Temperature Ranges
Operating Junction
Temperature Range
TJ
-40
Maximum Junction
Temperature
TJ
—
Storage Temperature Range TA
-65
Thermal Package Resistances
Thermal Resistance,
4-Lead 1x1 mm UDFN
Thermal Resistance,
3-Lead SOT-23
Thermal Resistance,
5-Lead SOT-23
Thermal Resistance,
3-Lead SC70
Thermal Resistance,
5-Lead SC70
JA
—
JC(Top) —
JA
—
JC(Top) —
JA
—
JC(Top) —
JA
—
JC(Top) —
JA
—
JC(Top) —
—
—
—
91.05
285.89
211.33
138.72
184.82
151.05
300.6
130.03
237.83
144.91
Max.
+85
+125
+150
—
—
—
—
—
—
—
—
—
—
Units
Conditions
°C Steady state
°C Transient
°C
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
JEDEC standard 4-layer FR4 board with
1 oz. copper and thermal vias
JEDEC standard 4-layer FR4 board with
1 oz. copper
2018-2019 Microchip Technology Inc.
DS20006088B-page 6