DSA6312ML3KB-T 查看數據表（PDF） - Microchip Technology

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DSA6312ML3KB-T

Ultra-Small, Ultra-Low Power MEMS Oscillator with Spread Spectrum for Automotive

Microchip Technology 

DSA63XX

4-Lead Very Thin Land Grid Array (AUA) - 2.5x2.0 mm Body [VLGA]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units

Dimension Limits

MILLIMETERS

MIN

NOM

MAX

Number of Terminals

N

Terminal Pitch

e

Terminal Pitch

e1

Overall Height

A

Standoff

A1

Substrate Thickness (with Terminals) A3

Overall Length

D

Overall Width

E

Terminal Width

b1

Terminal Length

L

4

1.65 BSC

1.25 BSC

0.79

0.84

0.89

0.00

0.02

0.05

0.20 REF

2.50 BSC

2.00 BSC

0.60

0.65

0.70

0.60

0.65

0.70

Notes:

Terminal 1 Index Chamfer

CH

-

0.225

-

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Package is saw singulated

3. Dimensioning and tolerancing per ASME Y14.5M

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-1202A Sheet 2 of 2

 2019 Microchip Technology Inc.

DS20006189A-page 19

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