I2C-Compatible RTC in a TDFN
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages.)
D
1
PIN 1
INDEX
AREA
A
A2
L
D2
PIN 1 ID
N
1
C0.35
b
E
E2
[(N/2)-1] x e
REF.
DETAIL A
e
A1
k
CL
L
e
A
NUMBER OF LEADS SHOWN ARE FOR REFERENCE ONLY
CL
L
e
DALLAS
SEMICONDUCTOR
PROPRIETARY INFORMATION
TITLE:
PACKAGE OUTLINE, 6, 8 & 10L,
TDFN, EXPOSED PAD, 3x3x0.80 mm
APPROVAL
DOCUMENT CONTROL NO.
21-0137
REV.
1
D2
16 ______________________________________________________________________________________