CS48DV2B View Datasheet(PDF) - Cirrus Logic
Part Name
Description
Manufacturer
CS48DV2B Datasheet PDF : 26 Pages
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CS48DV2B Data Sheet
32-bit Audio DSP for Dedicated Dolby Volume and Audistry by Dolby
5.4 Power Supply Characteristics
(Measurements performed under operating conditions)
Parameter
Operational Power Supply Current:
VDD: Core and I/O operating1
VDDA: PLL operating
VDDIO: With most ports operating
Total Operational Power Dissipation:
Min
Typ
Max
Unit
-
203
-
mA
-
8
-
mA
-
27
-
mA
480
mW
Standby Power Supply Current:
VDD: Core and I/O not clocked
VDDA: PLL halted
VDDIO: All connected I/O pins 3-stated by other ICs in system
T Total Standby Power Dissipation:
F 1. Dependent on application firmware and DSP clock speed.
-
100
-
μA
-
1
-
μA
-
50
-
μA
-
348
-
μW
A 5.5 Thermal Data (48-Pin LQFP)
Parameter
Symbol Min
R Junction Temperature
Tj
-
D Thermal Resistance (Junction to Ambient)
Two-layer Board1 θja
Four-layer Board2
-
-
L I Thermal Resistance (Junction to Top of Package)
Two-layer Board3 ψjt
IA H Four-layer Board4
-
-
Typ
-
63.5
54
0.70
0.64
Max
Unit
125
°C
-
°C / Watt
-
-
°C / Watt
-
T P 1. Two-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz. copper covering 20 % of the top &
bottom layers.
N L 2. Four-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz. copper covering 20 % of the top &
bottom layers and 0.5-oz. copper covering 90 % of the internal power plane & ground plane layers.
E E 3. To calculate the die temperature for a given power dissipation
T θ j = Ambient Temperature + [ (Power Dissipation in Watts) * ja ]
ID D 4. To calculate the case temperature for a given power dissipation
CONF Tc = Tj - [ (Power Dissipation in Watts) * ψjt ]
DS875F2
Copyright 2009 Cirrus Logic
11
CONFIDENTIAL
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