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C8051F97X View Datasheet(PDF) - Silicon Laboratories

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C8051F97X Datasheet PDF : 455 Pages
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1.2. Thermal Conditions
Table 1.15. Thermal Characteristics
Parameter
Thermal Resistance
Junction to Ambient
Thermal Resistance
Junction to Case
Symbol
JA
JC
Conditions
Still air, QFN 48
Still air, QFN 32
Still air, QFN 24
Still air, QFN 48
Still air, QFN 32
Still air, QFN 24
Min Typ Max
82
— 40.4 —
— 59.5 —
— 11.5 —
— 16.8 —
— 22.7 —
Units
°C/W
°C/W
1.3. Absolute Maximum Ratings
Stresses above those listed under Table 1.16 may cause permanent damage to the device. This is a stress rating
only and functional operation of the devices at those or any other conditions above those indicated in the operation
listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect
device reliability.
For more information on the available quality and reliability data, see the Quality and Reliability Monitor Report at
http://www.silabs.com/support/quality/pages/default.aspx.
Table 1.16. Absolute Maximum Limits
Parameter
Ambient Temperature under Bias
Storage Temperature
Voltage on any Port I/O Pin or RST
with Respect to GND
Voltage on VDD with Respect to
GND
Maximum Total Current through VDD
or GND
Maximum Current through RST or
any Port Pin
Maximum Total Current through all
Port Pins
Conditions
Min
Typ
–55
–65
–0.3
–0.3
Note: Exposure to maximum rating conditions for extended periods may affect device reliability.
Max
125
150
VDD + 0.3
4.0
500
100
200
Units
°C
°C
V
V
mA
mA
mA
21
Rev 1.1

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