P3041 View Datasheet(PDF) - Freescale Semiconductor

Part Name

Description

Manufacturer

P3041

P3041 QorIQ Integrated Processor Hardware Specifications

Freescale Semiconductor 

Hardware Design Considerations

3.8 Thermal Management Information

This section provides thermal management information for the flip chip plastic ball grid array (FC-PBGA) package for

air-cooled applications. Proper thermal control design is primarily dependent on the system-level design—the heat sink, airflow,

and thermal interface material.

The recommended attachment method to the heat sink is illustrated in this figure. The heat sink must be attached to the

printed-circuit board with the spring force centered over the die. This spring force should not exceed 10 pounds force (45

Newton).

Heat sink

FC-PBGA package (small lid)

Heat sink

clip

Adhesive or

thermal interface naterial

Die lid

Die

Printed-circuit board

Figure 61. Package Exploded Cross-Sectional View—FC-PBGA (with Lid) Package

The system board designer can choose between several types of heat sinks to place on the device. There are several

commercially-available thermal interfaces to choose from in the industry. Ultimately, the final selection of an appropriate heat

sink depends on many factors, such as thermal performance at a given air velocity, spatial volume, mass, attachment method,

assembly, and cost.

3.8.1 Internal Package Conduction Resistance

For the package, the intrinsic internal conduction thermal resistance paths are as follows:

• The die junction-to-case thermal resistance

• The die junction-to-lid-top thermal resistance

• The die junction-to-board thermal resistance

P3041 QorIQ Integrated Processor Hardware Specifications, Rev. 2

Freescale Semiconductor

153

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