P3041 View Datasheet(PDF) - Freescale Semiconductor

Part Name

Description

Manufacturer

P3041

P3041 QorIQ Integrated Processor Hardware Specifications

Freescale Semiconductor 

Package outline

Interconnects

Ball Pitch

Ball Diameter (typical)

Solder Balls

Module height (typical)

37.5 mm × 37.5 mm

1295

1.0 mm

0.60 mm

96.5% Sn, 3% Ag, 0.5% Cu

2.88 mm to 3.53 mm (Maximum)

4.2 Mechanical Dimensions of the FC-PBGA

This figure shows the mechanical dimensions and bottom surface nomenclature of the chip.

Package Information

NOTES:

1. All dimensions are in millimeters.

2. Dimensions and tolerances per ASME Y14.5M-1994.

3. All dimensions are symmetric across the package center lines unless dimensioned otherwise.

4. Maximum solder ball diameter measured parallel to datum A.

5. Datum A, the seating plane, is determined by the spherical crowns of the solder balls.

P3041 QorIQ Integrated Processor Hardware Specifications, Rev. 2

Freescale Semiconductor

155

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