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74HC259BQ View Datasheet(PDF) - NXP Semiconductors.

Part Name
Description
Manufacturer
74HC259BQ
NXP
NXP Semiconductors. NXP
74HC259BQ Datasheet PDF : 21 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
NXP Semiconductors
74HC259; 74HCT259
8-bit addressable latch
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
D
c
y
Z
16
9
E
A
X
HE
vM A
pin 1 index
1
e
8
wM
bp
A2
A1
Q
(A 3)
A
θ
Lp
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1) E (2) e
HE
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOT403-1
MO-153
L
Lp
Q
v
w
y
Z (1) θ
1
0.75 0.4
0.50 0.3
0.2 0.13
0.1
0.40
0.06
8o
0o
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
Fig 16. Package outline SOT403-1 (TSSOP16)
74HC_HCT259_4
Product data sheet
Rev. 04 — 25 February 2009
© NXP B.V. 2009. All rights reserved.
17 of 21

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