DSP56374 View Datasheet(PDF) - Motorola => Freescale

Part Name

Description

Manufacturer

DSP56374

24-Bit Audio Digital Signal Processor

Motorola => Freescale 

Thermal Characteristics

6

Thermal Characteristics

Table 16. Thermal Characteristics

Characteristic

Natural Convection, Junction-to-ambient thermal

resistance1,2

Junction-to-case thermal resistance3

Symbol

RθJA or θJA

RθJC or θJC

LQFP Values

68 (52 LQFP)

50 (80 LQFP)

17 (52 LQFP)

11 (80 LQFP)

Unit

°C/W

°C/W

Note:

1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site

(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board

thermal resistance.

2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.

3. Thermal resistance between the die and the case top surface as measured by the cold plate method

(MIL SPEC-883 Method 1012.1).

7

DC Electrical Characteristics

Table 17. DC Electrical Characteristics

Characteristics

Symbol

Min

Typ

Max

Unit

Supply voltages

• Core (Core_VDD)

• PLL (PLLD_VDD)

VDD

1.2

1.25

1.3

V

Supply voltages

• VIO_VDD

• PLL (PLLP_VDD)

• PLL (PLLA_VDD)

VDDIO

3.14

3.3

3.46

V

Input high voltage

V

• All pins

VIH

2.0

—

VIO_VDD+2V

Note: All 3.3 volt supplies must rise prior to the rise of the 1.25 volt supplies to avoid a high current condition and possible system

damage.

Input low voltage

• All pins

VIL

–0.3

—

Input leakage current

IIN

—

—

Clock pin Input Capacitance (EXTAL)

CIN

4.7

High impedance (off-state) input current (@ 3.46V)

ITSI

–10

—

Output high voltage

IOH = -5 mA.

XTAL Pin IOH = -10mA

VOH

2.4

—

Output low voltage

IOH = 5 mA.

XTAL Pin IOH = 10mA

VOL

—

—

0.8

V

± 84

µA

pF

84

µA

—

V

0.4

V

26

PRELIMINARY

Freescale Semiconductor

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