PRELIMINARY - 6/15/93
Thermal Characteristics — CQFP Package
Characteristics
Thermal Resistance — Ceramic
Junction to Ambient
Junction to Case (estimated)
Symbol
ΘJA
ΘJC
Value
40
7
Thermal Characteristics — PQFP Package
Characteristics
Thermal Resistance — Plastic
Junction to Ambient
Junction to Case (estimated)
Symbol
ΘJA
ΘJC
Value
35
13
Rating
°C/W
°C/W
Rating
°C/W
°C/W
This device contains protective circuitry against damage due to high static voltage or electrical fields; how-
ever, it is advised that normal precautions be taken to avoid application of any voltages higher than maxi-
mum rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are
tied to an appropriate logic voltage level (e.g., either Vss or Vdd).
MOTOROLA
DSP56166 Technical Data Sheet
2