HIN232CB-T View Datasheet(PDF) - Intersil
Part Name
Description
Manufacturer
HIN232CB-T Datasheet PDF : 20 Pages
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HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Absolute Maximum Ratings
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) < VCC < 6V
V+ to Ground (Note 2) . . . . . . . . . . . . . . . (VCC -0.3V) < V+ < 13.2V
V- to Ground. . . . . . . . . . . . . . . . . . . . . . . . -12V < V- < (GND +0.3V)
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24V
Input Voltages
TIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V < VIN < (V+ +0.3V)
RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30V
Output Voltages
TOUT . . . . . . . . . . . . . . . . . . . .(V- -0.3V) < VTXOUT < (V+ +0.3V)
ROUT . . . . . . . . . . . . . . . . . (GND -0.3V) < VRXOUT < (V+ +0.3V)
Short Circuit Duration
TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ROUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
Operating Conditions
Temperature Range
HIN2XXCX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 70oC
HIN2XXIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
Thermal Information
Thermal Resistance (Typical, Note 3)
θJA (oC/W)
16 Ld PDIP Package*. . . . . . . . . . . . . . . . . . . . . . . .
90
24 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . .
70
16 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
100
24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
75
28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
70
28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .
95
44 Ld MQFP Package . . . . . . . . . . . . . . . . . . . . . . .
80
Maximum Junction Temperature (Plastic Package) . . . . . . . .150oC
Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300oC
(SOIC, SSOP, MQFP - Lead Tips Only)
*Pb-free PDIPs can be used for through hole wave solder processing
only. They are not intended for use in Reflow solder processing
applications.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
2. Only HIN239. For V+ > 11V, C1 must be ≤0.1µF.
3. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications Test Conditions: VCC = +5V ±10%, TA = Operating Temperature Range
PARAMETER
TEST CONDITIONS
MIN
SUPPLY CURRENTS
Power Supply Current, ICC
No Load,
HIN232
-
TA = 25oC
HIN236-HIN238, HIN240-HIN241
-
HIN239
-
V+
No
Power Supply Current,
Load, TA = 25oC
ICC
No Load,
TA = 25oC
HIN239
-
Shutdown Supply Current, ICC(SD)
TA = 25oC
-
LOGIC AND TRANSMITTER INPUTS, RECEIVER OUTPUTS
Input Logic Low, VlL
TIN, EN, Shutdown
-
Input Logic High, VlH
TIN
2.0
EN, Shutdown
2.4
Transmitter Input Pullup Current, IP
TIN = 0V
-
TTL/CMOS Receiver Output Voltage Low, VOL IOUT = 1.6mA
-
TTL/CMOS Receiver Output Voltage High, VOH IOUT = -1.0mA
3.5
RECEIVER INPUTS
RS-232 Input Voltage Range VIN
-30
Receiver Input Impedance RIN
VIN = ±3V
3.0
Receiver Input Low Threshold, VlN (H-L)
VCC = 5V, TA = 25oC
0.8
Receiver Input High Threshold, VIN (L-H)
VCC = 5V, TA = 25oC
-
Receiver Input Hysteresis VHYST
0.2
TYP MAX UNITS
5
10
mA
7
15
mA
0.4
1
mA
5.0
15
mA
1
10
µA
-
0.8
V
-
-
V
-
-
V
15
200
µA
0.1
0.4
V
4.6
-
V
-
+30
V
5.0
7.0
kΩ
1.2
-
V
1.7
2.4
V
0.5
1.0
V
8
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