LH28F008SCL-12 View Datasheet(PDF) - Sharp Electronics

Part Name

Description

Manufacturer

LH28F008SCL-12

Flash Memory 8M (1M ×8)

Sharp Electronics 

SHARP

LHF08CH3

3-2. Outline dimension of tray

Refer to attached drawing

42

1

4. Storage and Opening of Dry Packing

4-l.

Store under conditions shown below before opening t he dry packing

(1) Temperature range : 5-40°C

(2) Humidity

: 80% RH or less

4 - 2.

Notes on opening the dry packing

(1) Before opening the dry packing, prepare a working table which is

grounded against ESDand use a grounding strap.

(2) The tray has been treated to be conductive or anti-static. If the

device is transferred to another tray, use a equivalent tray.

4 - 3.

Storage after opening the dry packing

Perform the following to prevent absorption of moisture after opening.

( 1) After opening the dry packing, store the ICs in an environment with a

temperature of 5--25°C and a relative humidity of 60% or less and

mount ICs within 72 hours after opening dry packing.

4 - 4.

Baking (drying) before mounting

(1) Baking is necessary

(A) If the humidity indicator in the desiccant becomespink

(B) If the procedure in section 4-3 could not be performed

( 2) Recommendedbaking conditions

If the above conditions (A) and (B) are applicable, bake it before

mounting. The recommendedconditions are 16-24 hours at 120°C.

Heat resistance tray is used for shipping tray.

5. Surface Mount Conditions

Please perform the following conditions when mounting ICs not to deteriorate IC

quality.

5-l .Soldering

conditions(The following conditions are valid only for one time soldering.)

1Mounting Method Temperature and Duration

Measurement Point

Reflow solder ing Peak temperature of 230°C or less,

IC package

(air)

duration of less than 15 seconds.

surface

200°C or over,durat ion of less than 40 seconds.

Temperature increase rate of I--4”C/second

Manual soldering 260°C or less, duration of less

IC outer lead

(soldering iron) than 10 seconds.

surface

5-2. Conditions for removal of residual flux

( 1) Ultrasonic washing power : 25 Watts/liter or less

(2) Washing time

: Total 1 minute maximum

(3) Solvent temperature

: 15-40°C

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