MCF51JF128(2011) View Datasheet(PDF) - Freescale Semiconductor
Part Name
Description
Manufacturer
MCF51JF128 Datasheet PDF : 71 Pages
| |||
Bus clock
Data outputs
Data inputs
R1
R2
R3
R4
Thermal specifications
Figure 4. RGPIO timing diagram
5.4 Thermal specifications
5.4.1 Thermal operating requirements
Table 11. Thermal operating requirements
Symbol
TJ
TA
Description
Die junction temperature
Ambient temperature
Min.
Max.
Unit
–40
125
°C
–40
105
°C
5.4.2 Thermal attributes
Board type Symbol
Description
64 LQFP
64
48 LQFP
44
32 QFN Unit Notes
Laminate
Laminate
QFN
QFN
Single-layer RθJA
Thermal resistance, 73
108
79
108
98
°C/W 1
(1s)
junction to ambient
(natural convection)
Four-layer RθJA
Thermal resistance, 54
69
(2s2p)
junction to ambient
(natural convection)
55
69
33
°C/W 1
Single-layer RθJMA
Thermal resistance,
61
91
(1s)
junction to ambient
(200 ft./min. air speed)
66
91
81
°C/W 1
Four-layer RθJMA
Thermal resistance,
48
63
(2s2p)
junction to ambient
(200 ft./min. air speed)
48
63
28
°C/W 1
Table continues on the next page...
MCF51JF128 Advance Information Data Sheet, Rev. 2, 05/2011.
Freescale Semiconductor, Inc.
Preliminary
19
Share Link: 