MCF51JF128(2011) View Datasheet(PDF) - Freescale Semiconductor
Part Name
Description
Manufacturer
MCF51JF128 Datasheet PDF : 71 Pages
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Peripheral operating requirements and behaviors
Board type Symbol
Description
—
RθJB
Thermal resistance,
junction to board
—
RθJC
Thermal resistance,
junction to case
—
ΨJT
Thermal
characterization
parameter, junction to
package top outside
center (natural
convection)
64 LQFP
64
48 LQFP
44
32 QFN Unit Notes
Laminate
Laminate
QFN
QFN
37
44
34
44
13
°C/W 2
20
31
20
31
2.2
°C/W 3
5.0
6.0
4.0
6.0
6.0
°C/W 4
1. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions
—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
2. Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental Conditions
—Junction-to-Board.
3. Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate
temperature used for the case temperature. The value includes the thermal resistance of the interface material between
the top of the package and the cold plate.
4. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions
—Natural Convection (Still Air).
6 Peripheral operating requirements and behaviors
6.1 Core modules
6.1.1 Debug specifications
Table 12. Background debug mode (BDM) timing
Number
1
2
Symbol
tMSSU
tMSH
Description
BKGD/MS setup time after issuing background
debug force reset to enter user mode or BDM
BKGD/MS hold time after issuing background
debug force reset to enter user mode or BDM1
Min.
500
100
Max.
—
—
Unit
ns
µs
1. To enter BDM mode following a POR, BKGD/MS should be held low during the power-up and for a hold time of tMSH after
VDD rises above VLVD.
6.2 System modules
There are no specifications necessary for the device's system modules.
MCF51JF128 Advance Information Data Sheet, Rev. 2, 05/2011.
20
Preliminary
Freescale Semiconductor, Inc.
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