MCIMX25(2009) View Datasheet(PDF) - Freescale Semiconductor

Part Name

Description

Manufacturer

MCIMX25
(Rev.:2009)

i.MX25 Applications Processor for Consumer and Industrial Products

Freescale Semiconductor 

Figure 2 shows the power-up sequence diagram. After POR_B is asserted, Core VDD and NVDDx can be

powered up. After Core VDD and NVDDx are stable, the analog supplies can be powered up.

POR_B

QVDD and NVDD

Analog Supplies

Figure 2. Power-Up Sequence Diagram

3.2.2 Power-Down Sequence

There are no special requirements for the power-down sequence. All power supplies can be shut down at

the same time.

3.3 Thermal Characteristics

The thermal resistance characteristics for the device are given in Table 12. These values were measured

under the following conditions:

• Two-layer substrate

• Substrate solder mask thickness: 0.025 mm

• Substrate metal thicknesses: 0.016 mm

• Substrate core thickness: 0.200 mm

• Core via I.D: 0.118 mm, Core via plating 0.016 mm.

• Flag: Trace style with ground balls under the die connected to the flag

• Die Attach: 0.033 mm non-conductive die attach, k = 0.3 W/m K

• Mold compound: Generic mold compound; k = 0.9 W/m K

Table 12. Thermal Resistance Data

Rating

Junction to ambient1 natural convection

Junction to ambient1 natural convection

Junction to ambient1 (@200 ft/min)

Junction to ambient1 (@200 ft/min)

Junction to boards2

Condition

Single layer board (1s)

Four layer board (2s2p)

Single layer board (1s)

Four layer board (2s2p)

—

Symbol

ReJA

ReJA

ReJMA

ReJMA

ReJB

Value

55

33

46

29

22

Unit

°C/W

°C/W

°C/W

°C/W

°C/W

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 2

16

Freescale Semiconductor

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