MT41J128M8 View Datasheet(PDF) - Micron Technology

Part Name

Description

Manufacturer

MT41J128M8

DDR3 SDRAM

Micron Technology 

Figure 10: 78-Ball FBGA – x4, x8 (HX)

1Gb: x4, x8, x16 DDR3 SDRAM

Package Dimensions

Seating

plane

A

0.12 A

78X Ø0.45

Solder ball

material: SAC305.

Dimensions apply to

solder balls post-

reflow on Ø0.33

NSMD ball pads.

987

9.6

CTR

0.8 TYP

0.8 ±0.1

321

Ball A1 ID

A

B

C

D

E

F

G 11.5 ±0.15

H

J

K

L

M

N

0.8 TYP

6.4 CTR

9 ±0.15

Note: 1. All dimensions are in millimeters.

Ball A1 ID

1.2 MAX

0.25 MIN

PDF: 09005aef826aa906

1Gb_DDR3_SDRAM.pdf - Rev. L 03/13 EN

26

Micron Technology, Inc. reserves the right to change products or specifications without notice.

‹ 2006 Micron Technology, Inc. All rights reserved.

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