MT41J128M8 View Datasheet(PDF) - Micron Technology
Part Name
Description
Manufacturer
MT41J128M8 Datasheet PDF : 214 Pages
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1Gb: x4, x8, x16 DDR3 SDRAM
Package Dimensions
Figure 13: 96-Ball FBGA – x16 (JT)
0.155
Seating plane
1.8 CTR
Nonconductive
overmold
96X Ø0.45
Dimensions apply
to solder balls post-
reflow on Ø0.35
SMD ball pads.
987
321
14 ±0.1
12 CTR
0.8 TYP
A
0.12 A
Ball A1 ID
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
Ball A1 ID
0.8 TYP
1.1 ±0.1
6.4 CTR
0.25 MIN
8 ±0.1
Notes: 1. All dimensions are in millimeters.
2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu)
PDF: 09005aef826aa906
1Gb_DDR3_SDRAM.pdf - Rev. L 03/13 EN
29
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2006 Micron Technology, Inc. All rights reserved.
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