DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

S25FL127S View Datasheet(PDF) - Spansion Inc.

Part Name
Description
Manufacturer
S25FL127S Datasheet PDF : 131 Pages
First Prev 121 122 123 124 125 126 127 128 129 130
Data Sheet (Preliminary)
Ordering Information
13. Ordering Information
The ordering part number is formed by a valid combination of the following:
S25FL 127 S AB M F
I 10 1
Packing Type
0 = Tray
1 = Tube
3 = 13” Tape and Reel
Model Number (Package Details and RESET#)
10 = SO/USON footprint
C0 = 5 x 5 ball BGA footprint with RESET#
D0 = 4 x 6 ball BGA footprint with RESET#
Temperature Range
I = Industrial (–40°C to + 85°C)
V = Automotive In-Cabin (–40°C to + 105°C)
Package Materials
F = Lead (Pb)-free
H = Low-Halogen, Lead (Pb)-free
Package Type
M = 8-pin SO package
N = 8-contact USON 6 x 5 mm package
B = 24-ball BGA 6 x 8 mm package, 1.00 mm pitch
Speed
AB = 108 MHz
Device Technology
S = 0.065 µm MirrorBit Process Technology
Density
127 = 128 Mbit
Device Family
S25FL
Spansion Memory 3.0 Volt-Only, Serial Peripheral Interface (SPI) Flash Memory
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local
sales office to confirm availability of specific valid combinations and to check on newly released
combinations.
Base Ordering
Part Number
S25FL127S
Speed
Option
AB
AB
AB
Package and
Temperature
MFI, MFV
NFI, NFV
BHI, BHV
Valid Combinations
Model Number Packing Type
10
10
C0, D0
0, 1, 3
0, 3
Package Marking (1)
FL127 + S + (Temp) + F + (Model Number)
FL127 + S + (Temp) + F + (Model Number)
FL127 + S + (Temp) + H + (Model Number)
Note:
1. Example, S25FL127SABMFI100 package marking would be FL127SIF10
14. Contacting Spansion
Obtain the latest list of company locations and contact information at:
http://www.spansion.com/About/Pages/Locations.aspx
April 25, 2013 S25FL127S_00_02
S25FL127S
129

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]