XRD87L94 View Datasheet(PDF) - Exar Corporation

Part Name

Description

Manufacturer

XRD87L94

CMOS, 1 MSPS, 12-Bit Analog-to-Digital Converter with Parallel Logic Interface Port

Exar Corporation 

XRD87L94

ELECTRICAL CHARACTERISTICS TABLE (CONT’D)

Parameter

Symbol

Min

25°C

Typ

Max

Units Test Conditions/Comments

POWER SUPPLIES8

(Tmin to Tmax)

Operating Voltage (AVDD, DVDD)

VDD

Current (AVDD + DVDD)

IDD

AC PARAMETERS

3.3

V

12

mA

Signal Noise Ratio (N+D)

SNR

60

dB

FIN = 100 kHz

NOTES

1 Tester measures code transitions by dithering the voltage of the analog input (VIN). The difference between the measured and the

ideal code width (VREF/4096) is the DNL error. The INL error is the maximum distance (in LSBs) from the best fit line to

any transition voltage. Accuracy is a function of the sampling rate (FS).

2 Guaranteed. Not tested.

3 Specified values guarantee functionality. Refer to other parameters for accuracy.

4 –3 dB bandwidth is a measure of performance of the A/D input stage (S/H + amplifier). Refer to other parameters for accuracy within

the specified bandwidth.

5 Switched capacitor analog input requires driver with low output resistance.

6 All inputs have diodes to DVDD and DGND. Input(s) OE and MINV have internal pull down(s). Input DC currents will not exceed

specified limits for any input voltage between DGND and DVDD.

7 Condition to meet aperture delay specifications (tAP, tAJ). Actual rise/fall time can be less stringent with no loss of accuracy.

8 AGND & DGND pins are connected through the silicon substrate.

Specifications are subject to change without notice

ABSOLUTE MAXIMUM RATINGS (TA = +25°C unless otherwise noted)1, 2, 3

VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V

Storage Temperature . . . . . . . . . . . . . . –65 to +150°C

VREF(+) & VREF(–) . . . . . . . . . VDD +0.5 to GND –0.5 V

VIN . . . . . . . . . . . . . . . . . . . . . VDD +0.5 to GND –0.5 V

All Inputs . . . . . . . . . . . . . . . . VDD +0.5 to GND –0.5 V

All Outputs . . . . . . . . . . . . . . VDD +0.5 to GND –0.5 V

Lead Temperature

(Soldering 10 seconds) . . . . . . . . . . . . . . . . . . +300°C

Package Power Dissipation Rating @ 75°C

PDIP, SOIC . . . . . . . . . . . . . . . . . . . . . . . . . 1050mW

Derates above 75°C . . . . . . . . . . . . . . . . . 14mW/°C

NOTES:

1 Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a

stress rating only and functional operation at or above this specification is not implied. Exposure to maximum rating

conditions for extended periods may affect device reliability.

2 Any input pin which can see a value outside the absolute maximum ratings should be protected by Schottky diode clamps

(HP5082-2835) from input pin to the supplies. All inputs have protection diodes which will protect the device from short

transients outside the supplies of less than 100mA for less than 100µs.

3 VDD refers to AVDD and DVDD. GND refers to AGND and DGND.

Rev. 1.00

4

Share Link: