TS2012IQT View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

TS2012IQT

Filter-free stereo 2x2.8W class D audio power amplifer

STMicroelectronics 

Package information

Table 10. QFN20 package mechanical data

Dimensions in mm

Ref

Min

Typ

A

0.8

0.9

A1

0.02

A2

0.65

A3

0.25

b

0.18

0.23

D

3.85

4

D2

2.6

E

3.85

4

E2

2.6

e

0.45

0.5

L

0.3

0.4

ddd

Figure 48. QFN20 package footprint

TS2012

Max

1

0.05

1

0.3

4.15

4.15

0.55

0.5

0.08

FOOTPRINT DATA (mm)

A

4.55

B

4.55

C

0.50

D

0.35

E

0.65

F

2.45

G

0.40

Note:

The QFN20 package has an exposed pad E2 x D2. For enhanced thermal performance, the

exposed pad must be soldered to a copper area on the PCB, acting as a heatsink. This

copper area can be electrically connected to pin 4, 12, 18 (PGND, AGND) or left floating.

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